Microwave 3DIC-Microwave Three Dimensional Integrated Circuit
Small Business Information
Amcom Communications, Inc.
PO Box 179, Clarksburg, MD, 20871
Ho C. Huang
AbstractThe 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 technical objective is to assess the feasibility of microwave 3DIC concept and to develop a road map for the realization of practical microwave 3DICs for both commercial and military applications.
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