Microwave 3DIC-Microwave Three Dimensional Integrated Circuit

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 36226
Amount: $749,989.00
Phase: Phase II
Program: SBIR
Awards Year: 1998
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
PO Box 179, Clarksburg, MD, 20871
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Ho C. Huang
 (301) 353-8400
Business Contact
Phone: () -
Research Institution
The 3DIC concept is based on using multiple levels of thin film dielectric material, each having its own ground plane and microwave circuits, to stack up multiple circuit functions on top of each other. This approach reduces the IC footprint thereby reducing the usage of the semiconductor real estate, leading to substantial reduction in cost as well as improvement in performance. The phase 1 technical objective is to assess the feasibility of microwave 3DIC concept and to develop a road map for the realization of practical microwave 3DICs for both commercial and military applications.

* Information listed above is at the time of submission. *

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