Monolithic Magnetic Modules for High Density Aeronautic Power Converters
Small Business Information
American Research Corp Of Va
P.o. Box 3406, Radford, VA, 24143
Name: Dr Usha Varshney
Phone: (703) 731-0655
Phone: (703) 731-0655
Phone: () -
AbstractRecent development of planar magnetics has the potential to provide reduced volume, high efficiency and high power density power electronics, devices and components for future advanced 1 kW - 150 kW aeronautical power electronic system applications. At present, the best available modern commercial power converter volume exceeds that occupied by all of the electronic components in aeronautical power systems. In order to address the critical need of planar, highly efficient passive and active integrated magnetic components, the target of opportunity in this Small Business Innovative Research Phase I proposal lies in the development of monolithic magnetic modules compatible with future advanced electrical power system applications. The technology will reduce the overall manufacturing cost, size and weight of electronic or power electronic system by integrating all the passive and active magnetic components on a single monolithic module using a plasma spraying technique. In Phase I, feasibility of monolithic magnetic technology will be demonstrated by the fabrication of a 51mm x 51mm x 2.5mm monolithic magnetic module carrying the magnetic components of a 100W, 1 MHz power converter. The Phase I technical objectives include fabrication and analysis of substituted nickel zinc cobalt and manganese zinc cobalt ferrite powders, evaluation of laser patterning CAD/CAM techniques for fabrication of dies for monolithic module, identification of plasma spray deposition parameters for fabrication of near net shape substituted NiZnCo and MnZnCo ferrites thick films in monolithic magnetic module dies, and characterization and testing of monolithic magnetic modules leading to the design concept of a power converter salable to multi-kiloWatt power converter modules in the Phase II of the program.
* information listed above is at the time of submission.