QUALITY ASSURANCE OF SURFACE MOUNTED PRINTED CIRCUIT BOARD ASSEMBLY SOLDER JOINTS

Award Information
Agency:
Department of Defense
Amount:
$488,000.00
Program:
SBIR
Contract:
N/A
Solitcitation Year:
N/A
Solicitation Number:
N/A
Branch:
Air Force
Award Year:
1988
Phase:
Phase II
Agency Tracking Number:
5475
Solicitation Topic Code:
N/A
Small Business Information
American Science & Engineering
Fort Washington, Cambridge, MA, 02139
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
N/A
Principal Investigator
 Richard Mastronardi
 (617) 868-1600
Business Contact
Phone: () -
Research Institution
N/A
Abstract
A HIGH SPATIAL RESOLUTION AND HIGH SENSITIVITY X-RAY IMAGING SYSTEM HAS BEEN DEVELOPED THAT IS APPROPRIATE FOR THE IN-PROCESS INSPECTION OF SURFACE MOUNTED PRINTED CIRCUIT BOARD ASSEMBLIES. IT IS A NEAR REAL-TIME SYSTEM THAT PRODUCES HIGH-QUALITY DIGITAL IMAGES CAPABLE OF PROVIDING QUANTITATIVE DATA FOR FEEDBACK TO THE ASSEMBLY SOLDERING AND OTHER SURFACE MOUNTED TECHNOLOGY MANUFACTURING PROCESSES. THIS TECHNOLOGY OFFERS DISTINCT ADVANTAGES OVER CONVENTIONAL METHODS SUCH AS FILM AND FLUOROSCOPIC X-RAY RADIOGRAPHY, WHICH HAS BEEN USED IN THE PAST. OUR APPROACH TO SCAN THE ARTICLE USES A FAN BEAM ILLUMINATION OF THE TEST OBJECT AND A LINEAR ARRAY OF DETECTOR ELEMENTS. THE PATENTED DETECTOR CONFIGURATION IS THE KEY TO THE SYSTEM'S IMPRESSIVE PERFORMANCE. IT HAS BEEN DEMONSTRATED THAT DEFECTS AS SMALL AS 25 MICRONS (0.001 INCH) CAN BE DETECTED. IT IS OUR INTENT UNDER THIS PROGRAM, TO EXPLORE THE USE OF THIS NEW AND POWERFUL X-RAY INSPECTION TECHNOLOGY AS AN IMPORTANT PART OF A FEEDBACK LOOP IN AN INTEGRATED QUALITY ASSURANCE SYSTEM FOR OVERALL SOLDER JOINT EVALUATION OF SURFACE MOUNTED PRINTED CIRCUIT BOARD ASSEMBLIES.

* information listed above is at the time of submission.

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