Foundry Flexfet(c)SOI, a Commercial Revolution in Rad-Hard Processing

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DASG6003P0100
Agency Tracking Number: 022-0258
Amount: $69,589.00
Phase: Phase I
Program: SBIR
Awards Year: 2002
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
3100 S. Vista Ave., Suite 230, Boise, ID, 83705
DUNS: 076338677
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Douglas Hackler Sr.
 Principal Investigator
 (208) 336-2773
Business Contact
 Douglas Hackler Sr.
Title: President & CEO
Phone: (208) 336-2773
Research Institution
"Low cost, high-frequency, radiation-tolerant wafer fabrication for next generation electronic circuits is limited by domestic manufacturing capability. General availability of inherently radiation tolerant silicon-on-insulator (SOI) process technology tothe fabless design community is limited to only one viable domestic source. This proposal presents the opportunity to create U.S. foundry manufacturing of an advanced commercial radiation hardened SOI wafer fabrication process. FlexfetcSOI is a novelstate of the art process that provides deep sub-micron, sub-lithographic minimum feature size, double gated MOSFETs and 4-terminal dynamic threshold metal oxide semiconductor (DTMOS) transistor configuration. The double gate characteristics facilitate arevolutionary Dynamic Radiation Compensationc circuit architecture that expands low cost reliability of the process beyond that of static, traditional, isolation techniques. Successful execution of this proposal and the follow-on Phase II effort can resultin improvements in reliability, advanced materials, performance and cost for defense procurement of rad-hard, low power electronic circuits. A significant strategy for cost reduction is the commercialization opportunity from offering this advanced processin a foundry all defense circuit designers can access. Further, the foundry installation of FlexfetcSOI creates an inherently low cost fabrication base by consolidating multiple design or

* Information listed above is at the time of submission. *

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