Silicon on Insulator Pixel Detector for the Linear Collider

Award Information
Agency:
Department of Energy
Branch
n/a
Amount:
$94,145.00
Award Year:
2006
Program:
SBIR
Phase:
Phase I
Contract:
DE-FG02-06ER84452
Award Id:
77623
Agency Tracking Number:
80808S06-I
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
3100 S. Vista Avenue, Suite 230, Boise, ID, 83705
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Richard Hayhrust
Mr.
(208) 336-2773
rickhayhurst@americansemi.com
Business Contact:
Lorelli Hackler
Ms.
(208) 336-2773
lhackler@americansemi.com
Research Institute:
n/a
Abstract
The current generation of hybrid particle detectors at the International Linear Collider (ILC) falls well short of meeting the mass and resolution requirements: mass less than 0.1 radiation length/layer, resolution speed in the range of <50 microseconds, and high spatial resolution in three dimensions (<5 microns/hit in x, y). In addition, moderate radiation hardness (>100 KRad) is required. This project will develop a new low-mass, high-resolution, radiation-hard pixel sensor for Linear Collider use. Device thickness is expected to be 50 microns or less, with resolution speed in the range of 25ns and radiation tolerance in excess of 100Mrad. Phase I will design a silicon-on-insulator detector and associated readout circuitry for the ILC. Specific tasks include selection of the appropriate detector substrate material, design of the pixel and pixel amplifier, simulation and integration of the design using Flexfet technology, and studies of techniques for wafer thinning and backside contact fabrication. Commercial Applications And Other Benefits as described by the Applicant: In addition to the application for particle physics detectors, the technology also should find use in several commercial, military, and government imaging applications, such as medical imaging, Xray astronomy, X-ray imaging, and spectroscopy.

* information listed above is at the time of submission.

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