Low-Power, Rad-hard Reconfigurable, Bi-directional Flexfet¿ Level Shifter ReBiLS for Multiple Generation Technology Integration for Space Exploration

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNG06CA10C
Agency Tracking Number: 041939
Amount: $599,909.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solicitation Year: 2004
Solicitation Topic Code: S1.04
Solicitation Number: N/A
Small Business Information
American Semiconductor, Inc.
3100 S. Vista Ave., Suite 230, Boise, ID, 83705-0230
DUNS: 076338677
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Kelly DeGregorio
 Principal Investigator
 (208) 336-2773
 kellydegregorio@americansemi.com
Business Contact
 Douglas Hackler
Title: President & CEO
Phone: (208) 336-2773
Email: doughackler@americansemi.com
Research Institution
N/A
Abstract
The many different generations of integrated circuit (IC) technologies required for new space exploration systems demand designs operate at multiple and often incompatible voltages. Extended utilization of current and development of new space exploration systems require multiple voltage levels be successfully integrated to interface technologies. NASA's micro-satellites and space exploration missions, like the Space Technology 5 (ST5) Project, are current examples of systems that employ a variety of voltage levels. Spacecraft have limited supply voltages and power at their disposal and this encourages the use of a higher percentage of low voltage microelectronics. [4] To build complete systems there continues to be a common problem of mixing old and new equipment operating at different voltages. [3] ASI's FlexfetTM CMOS rad-hard reconfigurable bi-directional level shifters (ReBiLS) will allow NASA improved capability to design, develop and implement multi-level voltage systems. The ASI ReBiLS Phase II project will generate prototypes for stand-alone and embedded bidirectional level shifters. A stand-alone ReBiLS device will allow designers to provide efficient bi-directional communication between existing or COTS components operating at different voltages. An embedded ReBiLS cell will be demonstrated in a CULPRiT ULP circuit to demonstrate the on-chip integration of low-voltage, low-power core logic with high-voltage I/O.

* information listed above is at the time of submission.

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