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UAS Power Amplifier for Extended Range of Non-Payload Communication Devices (UPEND)

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX15CC19C
Agency Tracking Number: 144762
Amount: $749,993.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: A2.01
Solicitation Number: N/A
Solicitation Year: 2014
Award Year: 2015
Award Start Date (Proposal Award Date): 2015-05-01
Award End Date (Contract End Date): 2017-04-30
Small Business Information
122 Edison Drive
Middletown, OH 45044-3269
United States
DUNS: 032326790
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Tim Wurth
 CTO & VP Engineering
 (513) 360-0800
Business Contact
 Jeff Wells
Title: CEO & President
Phone: (513) 360-0800
Research Institution

The high-efficiency and linear UPEND RF C-band power amplifier was designed, simulated and partially prototyped in Phase I to provide range extension for the NASA/Rockwell Collins Control and Non-Payload Communication (CNPC) program's transceiver in support of NAS integration of UAS. UPEND leverages state-of-the-art analog pre-distortion linearization and Doherty power amplifier circuits, MMIC technology, and module-level power efficiency and thermal design, to minimize size, weight, and power consumption (SWaP) of the connectorized PA module, while maintaining the linear output required by amplitude modulation. The UPEND model achieved significant improvement in Error Vector Magnitude (EVM) and power efficiency, while the proof-of-concept prototype provided validation for the model with respect to EVM performance improvement with linearization.

In Phase II NuWaves will address the needs of both amplitude-modulated and constant-envelope waveforms by developing multiple MMICs and packaging them together as needed. Separate die will be fabricated for the Doherty amplifier and the linearizer circuits, wire bonded and packaged into two different component-level integrated circuits – one with and one without the linearizer. Two different connectorized PA module variants will be developed using these two component-level ICs, adding the necessary power supply circuitry, supporting circuitry, and mechanical and thermal design to address different NASA and commercial market needs.

* Information listed above is at the time of submission. *

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