High Temperature "Smart" P3 Sensors and Electronics for Distributed Engine Control

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX15CC48P
Agency Tracking Number: 154613
Amount: $124,990.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A1.07
Solicitation Number: N/A
Solicitation Year: 2015
Award Year: 2015
Award Start Date (Proposal Award Date): 2015-06-17
Award End Date (Contract End Date): 2015-12-17
Small Business Information
515 Courtney Way, Suite B, Lafayette, CO, 80026-8821
DUNS: 128688111
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Kevin Harsh
 Principal Investigator
 (303) 516-9075
Business Contact
 Mike Usrey
Title: VP Buisness Development
Phone: (303) 516-9075
Email: musrey@sporian.com
Research Institution
Current engine control architectures impose limitations on the insertion of new control capabilities due to weight penalties and reliability issues related to complex wiring harnesses. NASA in collaboration with Air Force Research Lab (AFRL) has been conducting research in developing technologies to enable Distributed Engine Control (DEC) architectures. Realization of such future intelligent engines depends on the development of both hardware and software, including high temperature electronics and sensors to make smart components. NASA is particularly interested in the design and development of these applications for assessing the benefit they bring to the engine system. Compressor discharge pressure measurement has long been a key aspect of turbine engine control to manage stall margin. Given that, there is a need for a high-temperature, smart P3 sensor as a key building block for distributed engine controls. Given the current limitations of high temperature electronics, the business case for smart control elements (sensors and actuators) can be made in the fan/compressor section of the engine. The long-term objective of the proposed effort is to advance high-temperature P3 sensor technology for DEC applications through working with OEM partners and industry working groups to: (1) to iterate the current technology toward DEC formats/functions, (2) advance the digital electronics design/firmware and high temperature electronics, and (3) (through demonstration and stakeholder collaboration) present the viability (technical and business case) of the proposed sensor.

* Information listed above is at the time of submission. *

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