Superconducting Developments for Compact Power and Energy Systems

Award Information
Agency:
Department of Defense
Amount:
$750,000.00
Program:
SBIR
Contract:
FA8650-05-C-2626
Solitcitation Year:
2004
Solicitation Number:
2004.3
Branch:
Air Force
Award Year:
2005
Phase:
Phase II
Agency Tracking Number:
O043-EP6-1185
Solicitation Topic Code:
OSD04-EP6
Small Business Information
AMERICAN SUPERCONDUCTOR
SuperMachines Business Unit, 121 Flanders Road, Westborough, MA, 01581
Hubzone Owned:
N
Woman Owned:
N
Socially and Economically Disadvantaged:
N
Duns:
185904497
Principal Investigator
 John Voccio
 Senior Technical Staff
 (508) 621-4243
 jvoccio@amsuper.com
Business Contact
 Tom Rosa
Title: V.P., Finance and Account
Phone: (508) 621-4265
Email: trosa@amsuper.com
Research Institution
N/A
Abstract
In summary, the proposed Phase II work furthers our understanding of 2G coil behavior and demonstrates coil technology through fabrication of a substantial prototype device using several hundred meters of 2G wire. The objective is technology-readiness for high power density rotating electric machines and magnet applications, such as gyrotrons. The thermal and mechanical properties of 2G coils will be well-characterized through extensive testing. Small test coils will be fabricated to study quench behavior, including the effects of varying amounts of stabilization and localized heating due to known mechanical defects. Both high-speed voltage and acoustic emission (AE) monitoring will be used as methods of quench detection. Some quench analysis will be conducted using the measured properties and results from the small coil quench testing. Also, some large 2G pancakes will be fabricated, tested and integrated into the 7T NRL magnet, which consists of 1G pancakes, to demonstrate a prototype, hybrid-style device. The modular, stackable design of this magnet will allow for different placement of the 2G pancakes within the 1G magnet stack. Finally, a comprehensive quench protection strategy will be selected and applied to this prototype device.

* information listed above is at the time of submission.

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