ON-WAFER TESTING OF MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICS)

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 5482
Amount: $45,118.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 1987
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
35 Technology Dr, Warren, NJ, 07060
DUNS: N/A
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 PHILLIP W WALLACE
 (201) 668-5000
Business Contact
Phone: () -
Research Institution
N/A
Abstract
WAFER PROBING IS THE CRITICAL LINK BETWEEN WAFER FABRICATION, AND DEVICE PACKAGING OR HYBRID SUBSYSTEM INSERTION. FOR GAAS MMICS TO BE COST EFFECTIVE, THEY MUST BE TESTED IN A MANNER THAT IS RELIABLE, FAST, AND EFFICIENT. THIS PROPOSAL DESCRIBES A PROGRAM TO DEVELOP EQUIPMENT AND TECHNIQUES FOR HIGH RATE, HIGH VOLUME MMIC WAFER PROBING. PHASE I OF THIS PROGRAM WILL INCLUDE AN EXPERIMENT USING EXISTING EQUIPMENT AND MMICS, AND RESEARCH TO DEFINE THE PRESENT STATE-OF-THE-ART, TO IDENTIFY THOSE AREAS WHICH MUST BE APPROACHED. HARDWARE COMPATIBLE WITH ACCURATE, HIGH-SPEED MICROWAVE TESTING, AND TECHNIQUES FOR INTERFACING THIS EQUIPMENT TO MMICS ON-WAFER WILL BE INVESTIGATED. REDUCING THE COST OF THE FINAL MMIC DEVICE BY EFFECTIVE SORTING OF DIE IS THE PRIMARY OBJECTIVE OF THIS WORK.

* Information listed above is at the time of submission. *

US Flag An Official Website of the United States Government