ON-WAFER TESTING OF MONOLITHIC MICROWAVE INTEGRATED CIRCUITS (MMICS)

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$45,118.00
Award Year:
1987
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
5482
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Anadigics Inc
35 Technology Dr, Warren, NJ, 07060
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
PHILLIP W WALLACE
(201) 668-5000
Business Contact:
() -
Research Institution:
n/a
Abstract
WAFER PROBING IS THE CRITICAL LINK BETWEEN WAFER FABRICATION, AND DEVICE PACKAGING OR HYBRID SUBSYSTEM INSERTION. FOR GAAS MMICS TO BE COST EFFECTIVE, THEY MUST BE TESTED IN A MANNER THAT IS RELIABLE, FAST, AND EFFICIENT. THIS PROPOSAL DESCRIBES A PROGRAM TO DEVELOP EQUIPMENT AND TECHNIQUES FOR HIGH RATE, HIGH VOLUME MMIC WAFER PROBING. PHASE I OF THIS PROGRAM WILL INCLUDE AN EXPERIMENT USING EXISTING EQUIPMENT AND MMICS, AND RESEARCH TO DEFINE THE PRESENT STATE-OF-THE-ART, TO IDENTIFY THOSE AREAS WHICH MUST BE APPROACHED. HARDWARE COMPATIBLE WITH ACCURATE, HIGH-SPEED MICROWAVE TESTING, AND TECHNIQUES FOR INTERFACING THIS EQUIPMENT TO MMICS ON-WAFER WILL BE INVESTIGATED. REDUCING THE COST OF THE FINAL MMIC DEVICE BY EFFECTIVE SORTING OF DIE IS THE PRIMARY OBJECTIVE OF THIS WORK.

* information listed above is at the time of submission.

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