Three-Dimensional Electromagnetic Modeling and Simulation of MMICs and Interconnects in Microwave Packages
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AbstractA methodology is proposed for introducing the capability of modeling active MMICs into the industry-standard three dimensional electromagnetic field simulator High Frequency Structure Simulator (HFSS) and Maxwell SI Eminence. The first objective of the proposed work is to evaluate the existing capabilities of HFSS/Eminence for characterizing the passive three dimensional interconnect problems as specified in the solicitation. And the second objective is to explore the feasibility of incorporating zero-dimensional elements/sources into the general 3D finite element solver for modeling active devices. Our approach will draw on our recent research in implementing periodic boundary conditions for phased arrays, where the electric field on a surface is related to the electric field on another surface by phase constants.
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