Fabrication of Large-Area Distributed Electronic Modules
Small Business Information
6 Skyline Drive, Hawthorne, NY, 10532
AbstractHow can one make a sensor that can make different types of measurements on a large area, on a shape that is not known a priori, that is lightweight, that is accurate with a fine resolution, while at the same time has the resolution and sensitivity of astand-alone instrument, and at an affordable cost?'This proposal will develop a process and a tool to answer this commonly asked question in military, space and commercial sensor and electronics applications. Currently available sensors can make different types of measurements with a high degree ofaccuracy. These are limited in that they only measure the state of either a point or a small region on the body. A technology and process that extends this capability to address the remaining constraints will be of enormous benefit to the sensorcommunity.In this proposal we will design and build a proof-of-concept tool and demonstrate an associated process using in-house hardware to fabricate large-area distributed electronic modules. This tool will be capable of performing lithography, photoablation andexcimer laser crystallization on a single platform. In the follow on Phase II program, we will construct a fully functional tool for low-cost manufacturing of large-area distributed electronic modules. The proposed system will enable low-cost fabrication of a wide variety of electronic systems for novel space and military based applications. Numerous applications can be found in self-sufficient, large-area sensor skins that have an integrated powersource, wireless communication interfaces, etc. Such electronics systems will enable real-time `health-monitoring' of spacecraft, munition systems, personnel, food and critical life supplies in battlefield conditions. In addition, they would be used inthe commercial aircraft, automotive and shipbuilding industries for monitoring the state of critical operating systems.
* information listed above is at the time of submission.