Fabrication of Large-Area Distributed Electronic Modules

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$749,998.00
Award Year:
2004
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-04-C-R180
Award Id:
63507
Agency Tracking Number:
03SB1-0272
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ANVIK CORP. (Currently Anvik Corporation)
6 Skyline Drive, Hawthorne, NY, 10532
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
796359289
Principal Investigator:
Shyam Raghunandan
Project Manager
(914) 345-2442
shyamr@anvik.com
Business Contact:
Kanti Jain
President
(914) 345-2442
kjain@anvik.com
Research Institution:
n/a
Abstract
`How can one fabricate a sensor that can make different types of measurements on a large area, on a shape that is not known a priori, that is lightweight, that is accurate with a fine resolution, while at the same time has the resolution and sensitivity of a standalone instrument, and at an affordable cost?' This proposal will develop a process and a tool to answer this commonly asked question in military, space and commercial sensor and electronics applications. Currently available sensors can make different types of measurements with a high degree of accuracy. These are limited in that they only measure the state of either a point or a small region on the body. A technology and process that extends this capability to address the remaining constraints will be of enormous benefit to the sensor community. In this Phase II program we will create a detailed design and build a multifunctional production-worthy tool to fabricate large-area distributed electronic modules. This tool will be capable of performing lithography, photoablation and excimer laser crystallization on a single platform. In addition, we will demonstrate a suite of processes to fabricate large-area distributed electronics. In the Phase III program, we will commercialize the new multifunctional tool and the large-area sensor.

* information listed above is at the time of submission.

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