Fabrication of Large-Area Distributed Electronic Modules

Award Information
Agency: Department of Defense
Branch: Defense Advanced Research Projects Agency
Contract: W31P4Q-04-C-R180
Agency Tracking Number: 03SB1-0272
Amount: $1,180,000.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2003
Solicitation Topic Code: SB031-019
Solicitation Number: 2003.1
Small Business Information
6 Skyline Drive, Hawthorne, NY, 10532
DUNS: 796359289
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Shyam Raghunandan
 Project Manager
 (914) 345-2442
 shyamr@anvik.com
Business Contact
 Kanti Jain
Title: President
Phone: (914) 345-2442
Email: kjain@anvik.com
Research Institution
N/A
Abstract
`How can one fabricate a sensor that can make different types of measurements on a large area, on a shape that is not known a priori, that is lightweight, that is accurate with a fine resolution, while at the same time has the resolution and sensitivity of a standalone instrument, and at an affordable cost?' This proposal will develop a process and a tool to answer this commonly asked question in military, space and commercial sensor and electronics applications. Currently available sensors can make different types of measurements with a high degree of accuracy. These are limited in that they only measure the state of either a point or a small region on the body. A technology and process that extends this capability to address the remaining constraints will be of enormous benefit to the sensor community. In this Phase II program we will create a detailed design and build a multifunctional production-worthy tool to fabricate large-area distributed electronic modules. This tool will be capable of performing lithography, photoablation and excimer laser crystallization on a single platform. In addition, we will demonstrate a suite of processes to fabricate large-area distributed electronics. In the Phase III program, we will commercialize the new multifunctional tool and the large-area sensor.

* Information listed above is at the time of submission. *

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