Large-Area, Self-Sufficient, Low-Cost MEMS Skin with Integrated Wirleless Communication Capability

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNL05AA16C
Agency Tracking Number: 034396
Amount: $599,996.00
Phase: Phase II
Program: SBIR
Awards Year: 2005
Solicitation Year: 2003
Solicitation Topic Code: S1.03
Solicitation Number: N/A
Small Business Information
6 Skyline Dr., Hawthorne, NY, 10532-2165
DUNS: 796359289
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Shyam Raghunandan
 Principal Investigator
 (914) 345-2442
Business Contact
 Kanti Jain
Title: President
Phone: (914) 345-2442
Research Institution
One of the ultimate goals of sensor research is to build an integrated unit that harnesses its energy from its surroundings and reacts to, and transmits, any changes in its environment in a predictable and reliable manner. There are several components to this universal goal of a self-contained sensor unit: the power module, the sensor module, the control module, and the transmission module. The goal of this proposal is to develop a whole class of truly stand-alone, large-area, distributed sensor systems on a flexible substrate ? a MEMS skin. The Phase II program will deliver a suite of novel processes to fabricate large-format, self-sufficient sensors on flexible, multilayer substrates. The first layer, a copper-on-flex substrate, acts as the interconnect layer for power distribution. The second, a Si-on-flex substrate, utilizes a thin-film a-Si solar cell, integrated with Anvik's technology to integrate MEMS and IC devices. The two substrate layers are connected using photoablated micro-via patterns in the Si-on-flex layer. These sensors could include strain gauges for surface stress measurements, IR imagers, environment pollution/quality monitoring, etc. Our results in Phase I have given us an excellent footing to launch our Phase II workplan and to layout a preliminary Phase III commercialization strategy.

* Information listed above is at the time of submission. *

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