Large-Area, Self-Sufficient, Low-Cost MEMS Skin with Integrated Wirleless Communication Capability

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,996.00
Award Year:
2005
Program:
SBIR
Phase:
Phase II
Contract:
NNL05AA16C
Agency Tracking Number:
034396
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Anvik Corporation
6 Skyline Dr., Hawthorne, NY, 10532
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
796359289
Principal Investigator:
Shyam Raghunandan
(914) 345-2442
shyamr@anvik.com
Business Contact:
Dr. Kanti Jain
President
(914) 345-2442
kjain@anvik.com
Research Institution:
n/a
Abstract
One of the ultimate goals of sensor research is to build an integrated unit that harnesses its energy from its surroundings and reacts to, and transmits, any changes in its environment in a predictable and reliable manner. There are several components to this universal goal of a self-contained sensor unit: the power module, the sensor module, the control module, and the transmission module. The goal of this proposal is to develop a whole class of truly stand-alone, large-area, distributed sensor systems on a flexible substrate ? a MEMS skin. The Phase II program will deliver a suite of novel processes to fabricate large-format, self-sufficient sensors on flexible, multilayer substrates. The first layer, a copper-on-flex substrate, acts as the interconnect layer for power distribution. The second, a Si-on-flex substrate, utilizes a thin-film a-Si solar cell, integrated with Anvik's technology to integrate MEMS and IC devices. The two substrate layers are connected using photoablated micro-via patterns in the Si-on-flex layer. These sensors could include strain gauges for surface stress measurements, IR imagers, environment pollution/quality monitoring, etc. Our results in Phase I have given us an excellent footing to launch our Phase II workplan and to layout a preliminary Phase III commercialization strategy.

* information listed above is at the time of submission.

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