Highly Integrated, Reconfigurable, Large-Area, Flexible Radar Antenna Arrays

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNG05CA38C
Agency Tracking Number: 040413
Amount: $69,993.00
Phase: Phase I
Program: SBIR
Awards Year: 2005
Solicitation Year: 2004
Solicitation Topic Code: S4.03
Solicitation Number: N/A
Small Business Information
6 Skyline Dr, Hawthorne, NY, 10532-2165
DUNS: 796359289
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Marc Klosner
 Principal Investigator
 (914) 345-2442
Business Contact
 Kanti Jain
Title: Business Official
Phone: (914) 345-2442
Email: kjain@anvik.com
Research Institution
Highly-integrated, reconfigurable radar antenna arrays fabricated on flexible substrates offer high functionality in a portable package that can be rolled up and transported on the ground, or deployed into space. High levels of integration allow for: reconfigurability of operating frequency and / or gain pattern; integration of control, information processing, and communications functions directly onto the antenna substrate; integration of MEMS sensors into the antenna substrate to monitor the system health during deployment and in service; and opto-electronic beam forming networks, providing immunity to electromagnetic interference. While the advantages of highly-integrated flexible antennas are significant, their fabrication is highly challenging due to the lack of manufacturing technologies that can meet all of the processing requirements on flexible substrates. In this program we will develop and demonstrate a lithography-based process technology that enables a variety of critical processes that cannot be carried out using existing patterning technologies, in particular: the fabrication of the radar elements and feed structures on very-large-area substrates; the reduction of manufacturing costs by using photoablation processes; high levels of integration by means of laser-crystallization, allowing for the integration of high-performance ICs; and a combination of processes to produce MEMS for on-board sensors and for reconfiguring the array.

* Information listed above is at the time of submission. *

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