TRANSPARENT ELECTRODE VERTICAL CAVITY SURFACE EMITTING LASERMODULES FOR OPTICAL COMMUNICATION & SIGNAL PROCESSING APPLICATIONS.

Award Information
Agency:
National Science Foundation
Branch
n/a
Amount:
$49,945.00
Award Year:
1992
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Award Id:
17267
Agency Tracking Number:
17267
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
2950 Ne 84th Lane, Blaine, MN, 55434
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Dr Jim Van Hove
(612) 784-4995
Business Contact:
() -
Research Institution:
n/a
Abstract
HIGH SPEED OPTICAL LINKS ARE FINDING EVER INCREASING USES INOPTICAL COMMUNICATIONS AND SIGNAL PROCESSING APPLICATIONS. CURRENTLY AVAILABLE PLANAR WAVEGUIDE LASERS USED IN THESE LINKS SUFFER FROM A HIGH INSERTION LOSS DUE TO A MODE MISMATCH BETWEEN THE FIBER AND THE MODULATOR AND THE INABILITY TO IMPLEMENT A 2D ARRAY CONFIGURATIONS. THE VERTICAL CAVITY SURFACE EMITTING LASERS (VCSEL) CURRENTLY UNDER DEVELOPMENT AT SEVERAL U.S. LABS ADDRESS THESE PROBLEMS. THESE VCSEL DEVICES CONSISTS OF A QUANTUM WELL FABRY-PEROT CAVITY SANDWICHED BETWEEN N AND P DOPED HIGH REFLECTIVITY MIRRORS. VERTICAL CAVITY LASERS, HOWEVER SUFFER FROM A HIGH CONTACT RESISTANCE DUE TO A DOUGHNUT SHAPE TOP ELECTRODE. THIS LEADS TO INCREASED HEAT AND CURRENT CROWDING IN THE LASER. WE PROPOSE TO ELIMINATE THISPROBLEM BY DEPOSITING A TRANSPARENT TOP ELECTRODE MADE FROM SINGLE CRYSTAL GAN. GAN IS TRANSPARENT TO IR AND VISIBLE AND FORMS A OHMIC CONTACT TO HEAVY DOPED GAAS. THE PHASE I PROGRAM WILL DETERMINE IF THE VCSEL IS DAMAGED DURING THE GAN DEPOSITION AND MEASURE THE IMPROVEMENT IN THE TOP CONTACT RESISTANCE. THIS WILL BE FOLLOWED BY DEVELOPING 2D FIBER PIGTAILED VCSEL MODULES WITH MONOLITHIC DETECTORS IN PHASE II. ANTICIPATED BENEFITS: THE PROPOSED VCEL MODULES AND THE DEVELOPED TECHNOLOGY FORM THE BASIS OF SEVERAL HIGH SPEED MODULATOR, LASER AND OPTICALINTERCONNECT DEVICES. THESE OFFER UNIQUE SYSTEM ARCHITECTURAL POSSIBILITIES FOR FUTURE DOD AND COMMERCIAL SYSTEMS.

* information listed above is at the time of submission.

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