VIS-SWIR Solid State Silicon-Germanium Imaging Camera Development

Award Information
Agency: Department of Defense
Branch: Army
Contract: W909MY-09-C-0036
Agency Tracking Number: A082-100-0422
Amount: $69,969.00
Phase: Phase I
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: A08-100
Solicitation Number: 2008.2
Small Business Information
63 Albert Rd., Newton, MA, 02466
DUNS: 069212533
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Stefan Vasile
 (617) 964-1788
Business Contact
 Stefan Vasile
Title: President
Phone: (617) 964-1788
Research Institution
This proposal responds to the Army’s effort to fuse image intensification with infrared technologies and to rapidly meet warfighter’s protection needs. Small, lightweight, low cost, high-sensitivity solid-state infrared cameras widely disseminated on the battlefield would revolutionize land warfare. An effective sensor utilizing covert illumination and nightglow background would require a camera with extended response in the visible (VIS) and short wave infrared (SWIR). The objective of this program is to demonstrate through design, analysis, and semiconductor process improvement the technical feasibility of low-cost, solid-state single-photon detection VIS-SWIR Silicon-Germanium digital cameras with gating, range discrimination capabilities, high photon utilization and frame rate greater than 60 Hz. The core of the imaging camera will be a silicon photon-counting array with integrated SWIR Ge converter and low-noise CMOS readout. In Phase I we will improve the Ge converter process performance, will develop specific readout circuitry and new operation modes for this VIS-SWIR camera, will determine the achievable performance and will deliver a small prototype camera to demonstrate functionality, specific features and speed. If feasibility and target performance are demonstrated, the goal of the Phase II is to integrate the infrared converter into the camera fabrication flow, scale down the technology node and deliver prototypes capable of meeting the performance of today’s’ lattice-matched InGaAs cameras, but with superior manufacturability and readiness for production.

* Information listed above is at the time of submission. *

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