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Novel Ferroelectric Thin Film Materials for Radiation Hard, Non-Destructive Read Out (NDRO) Non-volatile Memory

Award Information
Agency: Department of Defense
Branch: Missile Defense Agency
Contract: DTRA01-01-P-0187
Agency Tracking Number: 01-0390
Amount: $65,000.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Timeline
Solicitation Year: N/A
Award Year: 2001
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
1420 Owl Ridge Dr.
Colorado Springs, CO 80919
United States
DUNS: N/A
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Lee Kammerdiner
 President
 (719) 948-2109
 lkammer@prodigy.net
Business Contact
 Lee Kammerdiner
Title: President
Phone: (719) 948-2109
Email: lkammer@prodigy.net
Research Institution
N/A
Abstract

This Small Business Innovation Research Phase I project proposes the development of novel materials to be used in a ferroelectric FET (Field Effect Transistor) memory cell. The proposed memory cell is non-volatile utilizing a non-destructive readout,single transistor design. As a result it has unlimited endurance, very small cell size and fast read and write. The most important properties to be evaluated are dielectric constant, coercive field and memory window. Based on the determination of thesecharacteristics, the best candidate will be chosen for incorporation in a prototype product for a Phase II effortThis cell can potentially replace all existing solid state non-volatile memory such as flash EEPROM and battery backed SRAM. Due to theproliferation of such products as cell phones, digital cameras, smart cards, solid state memory cards and others this market is experiencing tremendous growth. Also, because it is fast to read and write and has a small cell size it can be used inapplications currently served by DRAM. The former market is measured in billions of dollars, while the latter is in the tens of billions.

* Information listed above is at the time of submission. *

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