Tin Whisker Mitigation by Photonic Sintering for Sn-based Surface Finishes

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$100,000.00
Award Year:
2009
Program:
STTR
Phase:
Phase I
Contract:
HQ0006-09-C-7077
Award Id:
90094
Agency Tracking Number:
B08B-010-0020
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
3006 Longhorn Blvd., Suite 107, Austin, TX, 78758
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
013475129
Principal Investigator:
MohshiYang
Principal Investigator
(512) 339-5020
myang@appliednanotech.net
Business Contact:
NancyRuel
Contracts Manager
(512) 339-5020
nruel@appliednanotech.net
Research Institute:
University of Maryland
Michael Osterman
1103 Engineering Lab Building
College Park, MD, 20742 9121
(301) 405-5323
Nonprofit college or university
Abstract
For decades Sn/Pb components and circuit assemblies have been used for high reliability, high performance military and Air Force applications. With new legislation intended to eliminate lead from electronics manufacturing and packaging, the next generation of high performance devices will need to use only lead free technology. Unfortunately, lead free tin surfaces may form whiskers that may grow in length to cause electrical short circuits between adjacent components and devices. ANI has worked extensively on metallic conductive inks, successfully developing a copper conductive ink using copper metallic nanoparticles for inkjet printed electronic applications. This extraordinary success was achieved using a proprietary sintering process whereby a very short flash of photonic energy transforms the dried copper ink to metallic copper traces with conductivities close to levels expected for bulk Cu. We have demonstrated that this sintering process can totally flatten and eliminate copper nanowires and whiskers. We propose to extend this success, utilizing the sintering process as a post-deposition step to eliminate tin whiskers that may develop during the electrodeposition process. The systems are inexpensive, are commercially available, require less than one second process time, and can be integrated easily with current electrodeposition systems.

* information listed above is at the time of submission.

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