3D Simulation of Laser Additive Manufacturing to Predict Effect of Processing Parameters and Occurrence of Defects
Department of Defense
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Small Business Information
APPLIED OPTIMIZATION, INC.
8801 Windbluff Point, Centerville, OH, 45458
Socially and Economically Disadvantaged:
AbstractApplied Optimization proposes to complete the development of 3D Simulation of Ti-6Al-4V LAM, and demonstrate the capability by comparing the simulation results with those from a series of laser deposition trials. These trials will be performed on parts that are representative of the F-15, F-22 and C-17 components, and are of near term interest to the U.S. Air Force. The work will be performed in primary collaboration with Boeing Phantom Works and the Applied Research Laboratory at Penn State. The end deliverable of this effort, the LAM simulation software, is a viable product with an enduring potential, and Applied Optimization will commercialize it. The Phase II technical work will comprise six salient pieces as follows.  Generate radiometric properties for the laser-powder-substrate interaction.  Enhance physics and geometry models to include multiple-pass, stitched, intersection, and triple intersection laser deposits.  Develop a simulation feedback loop in order to determine the optimal combination of laser velocity and powder feed rate, by maintaining the melt pool topology and temperature within specifications, irrespective of the surrounding geometry.  Develop procedures to optimize the LAM deposit lay-up schedule, minimize the refresh time, and confirm tie-in selection for individual passes.  Achieve a hundred-fold speedup in the simulation by adaptively separating the linear and nonlinear regions in LAM, and by using methods that are most efficient for each region.  Perform deposition trials and validate the simulation. Executing these steps will create an automated 3D LAM simulation, which requires no user interaction once the simulation starts, and has the ability to simulate complex parts such as the F-22 Keelson web.
* information listed above is at the time of submission.