New Low Cost Resins Systems
Department of Defense
Agency Tracking Number:
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Small Business Information
APPLIED POLERAMIC, INC.
850 Teal Drive, Benicia, CA, 94510
Socially and Economically Disadvantaged:
AbstractFuture composite applications for Navy submarines and surface ships requires advanced polymeric matrices that have improved fire, smoke, and toxicity (FST) as compared to the present state of the art composite matrix resins of today. These matrixcharacteristics, along with the requirement of low cost composite manufacturing, provides a challenge for new resin development. As a first step in the development of matrix resins that meet the goal of Navy FST, is to develop a non-halogenated resin thatis capable of vacuum assisted resin transfer molding (VARTM), and has the same or better FST performance when compared to Derakane 510A, a halogenated vinyl ester resin. To develop matrix resins with improved FST characteristics, and capable of VARTMprocessing, new approaches must be taken in parallel with new materials and formulations. API proposes to focus primarily on epoxy chemistry, and modify these systems using a combination of reactive phosphorous and new compatible silicone compounds. Asynergistic effect has been shown for reducing FST properties when both organophosphorous and silicone materials are used in combination. Upon successful completion of this Phase I effort, the low visosity reactive phosphorous and silicone materialssynthesized will give the necessary formulating tools too improve both fire and mechanical properties of current F.R. epoxy technology. Proposed technology will offer the following marketing improvements over Derakane 510A vinylester.1)Low emmisions 2)Lesssmoke generation 3)Less toxic gases during fire 4)Low shrinkage 5)More damage tolerant. Potential commercial applications include: high speed water craft, passanger rail transport, oil rig crew compartments, oil drilling pipe,non-halogenated circuitboards,and earthquake retrofitting of hospitals and government buildings.
* information listed above is at the time of submission.