X-Band Digital Transmit Module for DBF Transmit/Receive Array

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: F19628-03-C-0024
Agency Tracking Number: 021SN-2091
Amount: $1,196,460.00
Phase: Phase II
Program: SBIR
Awards Year: 2004
Solicitation Year: 2002
Solicitation Topic Code: AF02-197
Solicitation Number: 2002.1
Small Business Information
210 Airport Street, Quonset Point, North Kingstown, RI, 02852
DUNS: 041546834
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 William Weedon
 (401) 295-0062
Business Contact
 William Weedon
Phone: (401) 295-0062
Email: whw@appliedradar.com
Research Institution
An X-band digital transmit module will be developed that is suitable for phased-array radar and communications applications. This proposed Phase II SBIR will combine our Phase-I X-band transmit module design with a DBF receiver that Applied Radar is developing through separate (non-SBIR) funding from AFRL. In addition, we will investigate the development of a synthesizer to provide a common LO signal to the transmit and receive modules. The design will utilize commercial off-the-shelf (COTS) components wherever possible. Careful attention will be paid to form factor, electrical and mechanical connectivity issues and thermal dissipation. This transmit module will utilize the same packaging and pinout as Applied Radar's DBF receive module. This will allow Applied Radar's existing digital receive beamformer (DBF processor) to function as a digital transmit beamformer with slight firmware modifications. The existing receive array aperture may also be used for transmit so that the transmit and receive arrays can be operated side-by-side in a bistatic configuration. This will allow rapid development and demonstration of a simultaneous transmit/receive X-band DBF array. Alternatively, the digital transmit module may be packaged together with the digital receive module and a LO synthesizer to form a versatile transceiver module for many commercial applications.

* Information listed above is at the time of submission. *

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