Advanced Multi-Layer Phased-Array Interconnect Technology

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$999,999.00
Award Year:
2009
Program:
SBIR
Phase:
Phase II
Contract:
W9113M-09-C-0072
Agency Tracking Number:
B073-036-0592
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
APPLIED RADAR, INC.
210 Airport Street, Quonset Point, North Kingstown, RI, 02852
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
041546834
Principal Investigator:
Steve Cheung
Principal Engineer
(401) 295-0062
scheung@appliedradar.com
Business Contact:
Michael Sherry
Vice-President
(401) 295-0062
msherry@appliedradar.com
Research Institution:
n/a
Abstract
The design and development of scalable panel-based phased-array radars requires the high density integration of solid-state components and adequate thermal mitigation within the array lattice constraints. The current integration technologies such as system-on-a-chip (SOC), multi-chip-module-deposition (MCM-D), and system-on-package (SOP), will help miniaturizing sub-modules for various functional layers of the system, but they are not the only solutions. For large phased-array with scalable capability, they need a high density interconnect (HDI) platform to provide functional integration for board-to-board transitions and on-board interfaces with large input/output counts within a limited area constrained by the array lattice and efficiency of networking. The HDI platform is need to combine with advanced multi-layer board technology in order to integrate active devices, provide the required RF manifold, DC power and digital control to the array, while providing adequate heat sinking for the phased-array. In Phase II, a prototype sub-module will be developed utilizing the developed HDI platform which integrates active array components into a demonstration sub-array. The developed HDI platform will be made to provide a compatible board-to-board interface and efficient network for the SOC, MCM-D and SOP technologies. The target frequency range is X-band, but the developed technology could be extended to other frequency ranges.

* information listed above is at the time of submission.

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