HIGH PERFORMANCE COMPOSITE HEAT SINK FOR ELECTRONIC DEVICES

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$49,911.00
Award Year:
1989
Program:
SBIR
Phase:
Phase I
Contract:
n/a
Agency Tracking Number:
9448
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
Applied Research Assocs Inc
4300 San Mateo Blvd Ne - Ste B, Albuquerque, NM, 87110
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
Aly H Shaaban
(919) 876-0018
Business Contact:
() -
Research Institution:
n/a
Abstract
THE INCREASED DEMANDS FOR LARGE SCALE INTEGRATION AND VERY HIGH SPEED PROCESSING OF INFORMATION HAVE LED TO INCREASING DENSITY OF CHIPS IN ELECTRONIC MODULES. THIS, IN TURN, HAS INCREASED DRAMATICALLY THE HEAT GENERATED PER UNIT AREA. IN ORDER TO MEET THE NEW DESIGN SPECIFICATIONS, AN INNOVATIVE HEAT SINK CONCEPT IS PROPOSED. THE HEAT SINK WILL HAVE A THERMAL EXPANSION IN THE RANGE OF 2.8 PPM/DEG F AND A THERMAL CONDUCTIVITY OF AT LEAST 250W/M DEG K TO MEET THE SPECIFICATION OF THE NAVY SEM. THE PROPOSED CONCEPT EMPLOYS CARBON FIBER STRUCTURE EMBEDDED IN RESIN MATRIX IMPREGNATED WITH HIGHLY CONDUCTIVE METAL FILLERS. THE CARBON FIBER STRUCTURE WILL BE DESIGNED USING BRAIDING TECHNOLOGY PROCESSES TO ACHIEVE THE REQUIRED THERMAL EXPANSION IN THE CRITICAL DIRECTIONS, WHILE USING THE FIBER STRUCTURE WITH THE METAL FILLER TO ACHIEVE THE THERMAL CONDUCTIVITY NEEDED. THE PHASE I WORK WILL DEMONSTRATE THE FEASIBILITY OF THE PROPOSED CONCEPT BY ENGINEERING THE FRACTION, TYPE, AND GEOMETRY OF METAL FILLER, RESIN MATRIX, AND FIBER IN THE ASSEMBLY.

* information listed above is at the time of submission.

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