Award Information
Agency: Department of Defense
Branch: Navy
Contract: N/A
Agency Tracking Number: 25676
Amount: $70,144.00
Phase: Phase I
Program: SBIR
Awards Year: 1994
Solicitation Year: N/A
Solicitation Topic Code: N/A
Solicitation Number: N/A
Small Business Information
141 West Xenia Ave, Po Box, 579, Cedarville, OH, 45314
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Jyh-ming Ting
 (513) 766-2020
Business Contact
Phone: () -
Research Institution
Due to the lack of techniques for buried metallization in PD or multilayer metallized PD, diamond has not been used as a material for electronic packaging. The primary obstacle in buried metallization in PD or producing multilayer metallized PD is the difficulty in generating good bonding between PD and selected metals, especially copper. It is proposed to develop the requisite technology using a combination of state-of-the-art methods for CVD diamond growth and ion processing. The enabling technology to be demonstrated in the Phase I research is the ability to create good adhesion between metal layers and PD, and the ability to nucleate and grow diamond over metallized PD. Well-bonded metal layers on the PD surface will be achieved using a combination of a substrate-biased diamond deposition technique, ion enhanced deposition, and multilayer metals including carbide formers. Deposition of diamond on metallized PD will be achieved by using similar combinations.

* Information listed above is at the time of submission. *

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