Passive Wireless Hydrogen Sensors Using Orthogonal Frequency Coded Acoustic Wave Devices

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,990.00
Award Year:
2007
Program:
STTR
Phase:
Phase II
Contract:
NNK07EA39C
Agency Tracking Number:
050121
Solicitation Year:
2005
Solicitation Topic Code:
T6.02
Solicitation Number:
n/a
Small Business Information
Applied Sensor Research & Development Corporation
Unit 2, 1195 Baltimore-Annapolis Blvd, Arnold, MD, 21012-1808
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
Y
Duns:
603565883
Principal Investigator:
Jacqueline Hines
Principal Investigator
(410) 544-4664
jhines@asrdcorp.com
Business Contact:
Jacqueline Hines
Business Official
(410) 544-4664
jhines@asrdcorp.com
Research Institution:
University of Central Florida
Not Available
4000 Central Florida Boulevard
Orlando, FL, 32816
(407) 823-2414
Domestic nonprofit research organization
Abstract
This proposal describes the continued development of passive orthogonal frequency coded (OFC) surface acoustic wave (SAW) based hydrogen sensors for NASA application to distributed wireless hydrogen leak detection systems. These novel sensors use an OFC SAW device structure, combined with Palladium (Pd) nanocluster film elements and hydrophobic self assembled monolayer (SAM) coatings to produce fast, reversible, highly sensitive hydrogen sensors capable of detecting a wide range of hydrogen concentrations at room temperature. The technical feasibility of these sensors was clearly demonstrated in Phase I. The Pd films experience conductivity changes due to the hydrogen induced stretching of the Pd nanoclusters and the quantum nature of conduction in nanocluster films. The performance of the SAW device will change in response to a change in conductivity of this film. Rapid (under 1 second) room temperature detection of hydrogen was observed, with complete reversibility of response. Compatibility of film conductivity with acoustic wave propagation and detection of changes in film conductivity using variations on SAW device delay were confirmed. Manufacturing compatible processes for SAM deposition and patterning were developed. The successful elimination of the potential technical risks accomplished in this Phase I effort provides a sound basis for further development of these sensors.

* information listed above is at the time of submission.

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