Enhanced CMC Performance Via Sealant Application

Award Information
Agency:
Department of Defense
Branch
Navy
Amount:
$80,000.00
Award Year:
2009
Program:
SBIR
Phase:
Phase I
Contract:
N68335-09-C-0266
Award Id:
92405
Agency Tracking Number:
N091-020-1737
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
1801 Maple Ave., Suite 5316, Evanston, IL, 60201
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
020126814
Principal Investigator:
Vikram Kaul
Materials R&D Scientist
(847) 467-5236
vkaul@atfinet.com
Business Contact:
Sankar Sambasivan
Materials R&D Scientist
(847) 287-6291
sankar@atfinet.com
Research Institute:
n/a
Abstract
High cost and poor environmental performance of CMCs are limiting their deployment in many defense applications. In particular, the JSF platform requires improved durability for a targeted CMC system which is already qualified and in production. Primary motivation for this Phase I effort is to reduce cost. CMCs, although known for their benefits of lightweight and better performance at elevated temperatures, their costs are relatively high compared to metallic counterparts. Cost reduction can be achieved through improved durability or reducing processing steps. Durability is a concern due to high temperature service and harsh environments. Degradation of these CMCs in humid/salt environments is of significant concern to the Navy and this need to be addressed urgently as JSF program advances toward production. In this Phase I project, a sealant application is being proposed to provide protection against pest oxidation at intermediate temperatures during service. The work will be conducted in close collaboration with a defense prime contractor along with other partners for mechanical testing, oxidation modeling, and material suppliers. Critical technical objectives to be addressed in this Phase I project include optimization of the CMC surfaces for better environmental performance and improved reliability along with potentially lowering cost.

* information listed above is at the time of submission.

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