Versatile Interconnect Prototyping

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$62,055.00
Award Year:
2001
Program:
SBIR
Phase:
Phase I
Contract:
DASG60-01-P-0069
Award Id:
53054
Agency Tracking Number:
01-0081
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
7052 E. 2nd Street, Tucson, AZ, 85710
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
019903512
Principal Investigator:
TroyWatson
Principal Technologist
(520) 298-1599
troyw@azstarnet.com
Business Contact:
TroyWatson
Owner
(520) 298-1599
troyw@azstarnet.com
Research Institute:
n/a
Abstract
The objective of this proposal is to demonstrate a new means to interconnect high-density electronic circuits and systems using discrete insulated wire. This insulated wire can interconnect high-density electronic devices with impedance-controlledconnections. These methods form the component receptacle from part of the interconnect wiring, where the signal and signal complement (or return) are homogenous and can be serially-linked (daisy-chained) with direct connections. Circuit boards, assemblies,systems, or cable assemblies can be interconnected with connections that are mechanically rugged and electrically balanced. Each connection can be tuned to have a specific characteristic impedance. Prior to assembly, the amount of capacitance andinductance (within a range) for each connection is calculated and downloaded to subsequently control the necessary actions to achieve the targeted characteristic impedance. Signals can be applied with a return wire that is twisted with, formed with, orapplied in a strip line fashion with, a return or complementary signal in order to achieve a specific characteristic impedance. This environmentally safe process can rapidly fabricate high-density, high-speed and low noise circuit boards using the latestdesign configuration in an agile fashion.Phase I will perform research to electrically characterize different discrete-wire receptacles and the different means to interconnect the receptacles with impedance-controlled connections. Phase II accomplishments will build the automated machinery androbotics to apply the receptacles and interconnect that were characterized in Phase I to provide to the electronics industry a new means to quickly fabricate rugged high-speed, high-density circuit boards using an environmentally-safe process.. Phase IIIwill fine-tune the automated methods to fabricate circuit board assemblies and will commercialize and market the advanced capabilities provided, to prototype rugged, high-speed and high-density electronic cable assemblies, circuit boards, and systems usingan environmentally-safe process.

* information listed above is at the time of submission.

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