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Advanced Electronic Cooling Technologies

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA9453-09-M-0159
Agency Tracking Number: F083-222-1692
Amount: $99,970.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: AF083-222
Solicitation Number: 2008.3
Solicitation Year: 2008
Award Year: 2009
Award Start Date (Proposal Award Date): 2009-01-28
Award End Date (Contract End Date): 2010-02-04
Small Business Information
8276 Eagle Road, Larkspur, CO, 80118
DUNS: 799077552
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 John Vetrovec
 (303) 681-0456
Business Contact
 Katerina Vetrovec
Title: VP of Business Developmen
Phone: (303) 681-0456
Research Institution
Aqwest proposes to develop an advanced thermal management for cooling of electronic components using a variable conductance heat sink (VCHS) offering unparalleled capabilities in high-heat flux handling and temperature control. The project will produce a cooling system with the following benefits to wide band gap amplifiers and high-power laser diodes (HPLD): 1) Heat flux handling > 1200 W/cm2 2) Easily scalable by stacking to >10 kW 3) Heat spreading with equivalent thermal conductivity  > 3000 W/m-K 4) Temperature control to < b1¢XC 5) Response time < 1 second 6) Compatible with DOD air and space environments The VCHS removes waste heat from semiconductor material and transfers it to system primary coolant.  It employs a miniature closed flow loop receiving waste heat from semiconductor chips at a high heat flux, transporting it by forced convection, and transferring it to an air-cooled heat sink or liquid-cooled heat exchanger at a much lower heat flux.  The flow is maintained electromagnetically without any moving parts.  Junction temperature is controlled by the flow velocity.  VCHS solves three (3) problems in one device: 1) effective removal/spreading of waste heat from semiconductor junctions 2) transfer of waste heat to a primary sink, and 3) temperature control.    BENEFIT: Enables operation of high-power electronic devices at increased power densities such as wide band gap semiconductors.  Provides effective cooling for new generations of high-power laser diodes. Applicable to military as well as commercial power electronics.  Commercial applications include cooling of electronics in electric hybrid vehicles.

* Information listed above is at the time of submission. *

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