Compact, Short-Pulse, SWIR Laser (1.5 micron) for Two- and Three-Dimensional Flash Imaging Sensor

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15P7T-06-C-P646
Agency Tracking Number: A052-100-0688
Amount: $1,228,720.00
Phase: Phase II
Program: SBIR
Awards Year: 2006
Solicitation Year: 2005
Solicitation Topic Code: A05-100
Solicitation Number: 2005.2
Small Business Information
P.O. Box 6024, Sherman Oaks, CA, 91413
DUNS: 082191198
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 James Murray
 Corporate Senior Scientis
 (520) 571-8660
Business Contact
 Dave Kane
Title: Vice President
Phone: (520) 571-8660
Research Institution
A key near-term objective of the Mission Equipment Packages (MEP) for Class II Unmanned Aerial Vehicle (UAV) program is to develop ultra-compact eyesafe 3D ladar and active 2D sensors for deployment on organic unmanned aerial vehicles. This will enable beyond-line-of-sight reconnaissance, surveillance, and target acquisition (RSTA) in areas shadowed by terrain features. New affordable solid state eyesafe (1.5 micron) lasers capable of generating the specified energy (20 mJ), pulse width (1-2 ns), pulse repetition frequency (50Hz), and package size (< 50 cubic inches) are required for these sensors. Lasers capable of meeting all of these requirements in a robust and reliable compact package do not currently exist. Traditional military laser packages rely on a stiff optical bench to provide the mechanical stability necessary to maintain laser cavity alignment in harsh environmental conditions. This strategy lacks modularity and is difficult to scale due to restrictions arising from conflicts between the optical layout, thermal and mechanical interfaces, and support electronics. Areté Associates’ laser systems group has developed an innovative packaging strategy that circumvents these difficulties. In this Phase-II, Areté Associates will design and build a compact short-pulse eyesafe laser that utilizes our proprietary packaging approach.

* Information listed above is at the time of submission. *

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