Compact, Short-Pulse, SWIR Laser (1.5 micron) for Two- and Three-Dimensional Flash Imaging Sensor

Award Information
Agency:
Department of Defense
Branch
Army
Amount:
$69,999.00
Award Year:
2005
Program:
SBIR
Phase:
Phase I
Contract:
W15P7T-06-C-S201
Award Id:
73961
Agency Tracking Number:
A052-100-0688
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
P.O. Box 6024, Sherman Oaks, CA, 91413
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
082191198
Principal Investigator:
James Murray
Corporate Senior Scientist
(520) 571-8660
jmurray@arete.com
Business Contact:
David Kane
VP Optical Engineering Division
(520) 571-8660
dkane@arete.com
Research Institute:
n/a
Abstract
A key near-term objective of the Mission Equipment Packages (MEP) for Class II Unmanned Aerial Vehicle (UAV) program is to develop ultra-compact eyesafe 3D ladar and active 2D sensors for deployment on organic unmanned aerial vehicles. This will enable beyond-line-of-sight reconnaissance, surveillance, and target acquisition (RSTA) in areas shadowed by terrain features. New affordable solid state eyesafe (1.5 micron) lasers capable of generating the specified energy (20 mJ), pulse width (1-2 ns), pulse repetition frequency (50Hz), and package size (< 50 cubic inches) are required for these sensors. Lasers capable of meeting all of these requirements in a robust and reliable compact package do not currently exist. Traditional military laser packages rely on a stiff optical bench to provide the mechanical stability necessary to maintain laser cavity alignment in harsh environmental conditions. This strategy lacks modularity and is difficult to scale due to restrictions arising from conflicts between the optical layout, thermal and mechanical interfaces, and support electronics. Aret¿ Associates' laser systems group has developed an innovative packaging strategy that circumvents these difficulties. Aret¿ Associates proposes a new and innovative short-pulse eyesafe laser configuration based on our proprietary packaging approach that will meet the MEP laser objectives.

* information listed above is at the time of submission.

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