Large Area Portable Radar Antenna Arrays

A novel manufacturing method is proposed for making very low cost UHF, EPC Gen 2 compatible RFID or large area phased array radar as complete, fully integrated "chipless" circuits directly combining RF/analog/digital circuit elements with antennas. Circuits are manufactured as arrays on large area, flexible substrates, using techniques compatible with Roll-to-Roll (R2R) processing, with the resulting large area wafer then subdivided into multiple, low cost tag circuits, or left as large area radar arrays. The innovative technique involves wavelength sensitive photolithography obviating the multiple steps in conventional photolithography and eliminating registration and alignment issues. The technique allows use of Silicon and conventional inorganic semiconductor materials and recipes for realizing higher mobility electronics at higher temperatures, avoiding the challenges of using organic materials.