High-Temperature Control Circuitry

Award Information
Agency:
Department of Defense
Branch
Office of the Secretary of Defense
Amount:
$100,000.00
Award Year:
2003
Program:
SBIR
Phase:
Phase I
Contract:
DAAD17-03-C-0086
Award Id:
66742
Agency Tracking Number:
O022-0497
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
700 W Research Center Blvd., Fayetteville, AR, 72701
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
121539790
Principal Investigator:
AlexanderLostetter
COO
(479) 443-5759
alostet@uark.edu
Business Contact:
AlexanderLostetter
COO
(479) 443-5759
alostet@uark.edu
Research Institute:
n/a
Abstract
The need is becoming ever greater for smaller, lighter, more compact, and higher density power electronics. With the introduction of SiC power diodes and the coming availability of high-temperature SiC power switches on the commercial market, the powerelectronics industry stands on the threshold of a revolution. APEI proposes to develop a 5 hp 3-phase inverter utilizing SiC power switches and silicon high-temperature MOS (HTMOS) control electronics. We will advance the state-of-the-arthigh-temperature control electronics, design and engineer solutions to highly detailed and problematic thermal and stress issues, and develop advanced power packaging processes specifically for high-temperature applications. The resulting powerelectronics module will be small and light-weight, compact with a control integrated solution, and operate at maximum temperatures exceeding 300 ¿C. The inverter will drive a 5 hp motor, operating with variable frequency, variable duty cycle pulse widthmodulation techniques, and employ over current and thermal protection shutdown strategies. High temperature power electronic inverters will be utilized in all areas of motor drive applications. The ability to operate at higher temperatures will increasethe miniaturization and size of all-types of motor drives, and when costs are reduced, they will become ubiquitous in the marketplace.

* information listed above is at the time of submission.

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