Ultra-Lightweight, High Efficiency Silicon-Carbide (SIC) Based Power Electronic Converters

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,995.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
NNC06CA21C
Agency Tracking Number:
041945
Solicitation Year:
2004
Solicitation Topic Code:
E2.07
Solicitation Number:
n/a
Small Business Information
Arkansas Power Electronics International, Inc.
700 W Research Blvd, Fayetteville, AR, 72701-7174
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
121539790
Principal Investigator:
Alexander Lostetter
Principal Investigator
(479) 443-5759
alostet@apei.net
Business Contact:
Sharmila Mounce
Design Engineer
(479) 443-5759
smounce@apei.net
Research Institution:
n/a
Abstract
In Phase I of this project, APEI, Inc. proved the feasibility of creating ultra-lightweight power converters (utilizing now emerging silicon carbide [SiC] power switching technologies) through the successful demonstration of power switch operation up to 500 oC. The goal of Phase II will be to design, fabricate, and fully test SiC based DC/DC converters that can achieve high power density and ultra-lightweight by operating the power switches at high junction temperatures. Present state-of-the-art silicon based spacecraft power systems operate at a power density of approximately 1.5 W/cm?, while the high temperature SiC based power converters proposed by APEI, Inc. in this project will operate at a power density of approximately 4.5 W/cm?, or 3? the density of present high performance silicon based systems. Theoretically, if the full potential of silicon carbide switches could be realized (junction temperature operation in excess of 600 oC), an order of magnitude power density improvement could be achieved. APEI, Inc. is proposing to fabricate up to three prototype high density (4.5 W/cm?) DC/DC converter designs: (1) 28V in / 5V out @ 25 watts (2) 28 V in / 5V out @ 100 watts (3) 28 V in / 5V out @ 1 kW

* information listed above is at the time of submission.

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