Silicon-Carbide (SIC) Multichip Power Modules (MCPMS) For Power Building Block Applications

Award Information
Agency:
National Aeronautics and Space Administration
Branch
n/a
Amount:
$599,982.00
Award Year:
2006
Program:
SBIR
Phase:
Phase II
Contract:
NNC06CA16C
Award Id:
76795
Agency Tracking Number:
041992
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
700 W Research Blvd, Fayetteville, AR, 72701
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
121539790
Principal Investigator:
AlexanderLostetter
Principal Investigator
(479) 443-5759
alostet@apei.net
Business Contact:
SharmilaMounce
Design Engineer
(479) 443-5759
smounce@apei.net
Research Institute:
n/a
Abstract
In Phase I, APEI, Inc. proved the feasibility of developing a modular, expandable and fault tolerant SiC-based power system through the successful demonstration of a four-module SiC-based power system capable of dynamic reconfiguration allowing the system to continue delivering power to the load without interruption in the event of a module failure. These results show the feasibility of developing miniaturized SiC multichip power modules (MCPMs) to form a core power building block component. The MCPM building blocks utilize a distributed control and communications structure, with a communications network established between the core silicon-on-insulator (SOI) controllers of the MCPMs, but with no single controller in command of the system. The decentralized control and modular approach allow for the construction of highly flexible, auto-configurable, stackable power systems to be connected in series and/or parallel to increase overall system power handling capabilities. Moreover, the identical core MCPM building blocks could be used in many power electronics applications, while various specific functions such as source regulation, energy storage regulation, and motor drives could be achieved by the use of external components. In addition, the development of high-temperature MCPMs allows high levels of miniaturization, power density, and efficiency resulting in highly reliable, compact, modular, and inexpensive power systems.

* information listed above is at the time of submission.

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