Silicon-Carbide (SIC) Multichip Power Modules (MCPMS) For Power Building Block Applications
National Aeronautics and Space Administration
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Small Business Information
ARKANSAS POWER ELECTRONICS INTERNATIONAL, INC.
700 W Research Blvd, Fayetteville, AR, 72701-7174
Socially and Economically Disadvantaged:
AbstractThis Small Business Innovation Research Phase I project seeks to prove the feasibility of developing high power density modular power electronic building blocks based upon high temperature silicon carbide (SiC) multichip power module (MCPM) technologies. The modular approach will allow for auto-configurable stackable modules to be built up in series and/or parallel configurations (through a "plug and play" fashion) in order to increase overall system power handling capabilities. The MCPM building blocks will utilize a decentralized control and communications structure, with a communications network established between the core silicon-on-insulator (SOI) controllers of the MCPMs, but with no single controller in command of the system. The decentralized control scheme will allow for the construction of highly flexible power systems which could perform a wide variety of power electronics applications, including power conversion, motor drive, and power distribution functions. In addition, the development of the MCPMs will be based upon high-temperature SiC power electronics technologies, thus driving the building block designs towards very miniaturized, high power density, high efficiency systems. Due to the high switching frequency capabilities of the SiC power switches, filter and magnetics components will also be reduced in size, thus further miniaturizing the MCPM building blocks. The reduction in size, weight, and volume will create significant savings in space launch costs, while the modular building block designs will increase flexibility, reduce engineering costs and time, improve reliability and fault tolerance, and allow for the implementation of auto-reconfiguration in the case of phase-leg or module failures.
* information listed above is at the time of submission.