High Temperature, High Power Density Silicon Carbide (SiC) Based Motor Drives for Aircraft Applications

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: FA8650-08-C-2861
Agency Tracking Number: F071-181-0577
Amount: $746,891.00
Phase: Phase II
Program: SBIR
Awards Year: 2008
Solicitation Year: 2007
Solicitation Topic Code: AF071-181
Solicitation Number: 2007.1
Small Business Information
535 W. Research Center Blvd., Suite 209, Fayetteville, AR, 72701
DUNS: 121539790
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Roberto Marcelo Schupbach
 Senior Engineering Manage
 (479) 443-5759
Business Contact
 Sharmila Mounce
Title: Business Operations Manag
Phone: (479) 443-5759
Email: smounce@apei.net
Research Institution
The terminal objective of this Phase II work will be the development of compact, fully integrated, high-temperature (250 °C), high-power-density SiC-based motor drives for avionics applications. The developed multi-chip power module (MCPM) will target an advanced motor drive application such as actuators (i.e., position control). The initial electrical rating targeted will be a 270 VDC input voltage system with power levels of up to 10 kW. The developed power module will integrate the following technologies: 1. SiC normally-off cascode power devices (provided by Microsemi) 2. APEI, Inc’s new high-temperature integrated substrate MCPM technology 3. High temperature HTMOS SOI digital control electronics 4. TRS Technologies’ wide-temperature high-voltage capacitors Several Phase II technology demonstration prototypes will be fabricated and fully tested. APEI, Inc. targets the achievement of a technology readiness level (TRL) of 6 at the end of this Phase II.

* Information listed above is at the time of submission. *

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