High Temperature, High Power Density Silicon Carbide (SiC) Based Motor Drives for Aircraft Applications

Award Information
Agency:
Department of Defense
Branch
Air Force
Amount:
$746,891.00
Award Year:
2008
Program:
SBIR
Phase:
Phase II
Contract:
FA8650-08-C-2861
Agency Tracking Number:
F071-181-0577
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
ARKANSAS POWER ELECTRONICS INTERNATIONAL
535 W. Research Center Blvd., Suite 209, Fayetteville, AR, 72701
Hubzone Owned:
N
Socially and Economically Disadvantaged:
N
Woman Owned:
N
Duns:
121539790
Principal Investigator:
Roberto Schupbach
Senior Engineering Manage
(479) 443-5759
mschupb@apei.net
Business Contact:
Sharmila Mounce
Business Operations Manag
(479) 443-5759
smounce@apei.net
Research Institution:
n/a
Abstract
The terminal objective of this Phase II work will be the development of compact, fully integrated, high-temperature (250 degrees C), high-power-density SiC-based motor drives for avionics applications. The developed multi-chip power module (MCPM) will target an advanced motor drive application such as actuators (i.e., position control). The initial electrical rating targeted will be a 270 VDC input voltage system with power levels of up to 10 kW. The developed power module will integrate the following technologies: 1. SiC normally-off cascode power devices (provided by Microsemi) 2. APEI, Inc's new high-temperature integrated substrate MCPM technology 3. High temperature HTMOS SOI digital control electronics 4. TRS Technologies' wide-temperature high-voltage capacitors Several Phase II technology demonstration prototypes will be fabricated and fully tested. APEI, Inc. targets the achievement of a technology readiness level (TRL) of 6 at the end of this Phase II.

* information listed above is at the time of submission.

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