Radiation Mitigation Methods for Advanced Readout Array

Award Information
Agency: National Aeronautics and Space Administration
Branch: N/A
Contract: NNX10CD69P
Agency Tracking Number: 095860
Amount: $100,000.00
Phase: Phase I
Program: SBIR
Awards Year: 2010
Solicitation Year: 2009
Solicitation Topic Code: S1.09
Solicitation Number: N/A
Small Business Information
240 W. Elmwood Drive, Suite 2010, Dayton, OH, 45459-4248
DUNS: 141943030
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: N
Principal Investigator
 Todd Grimes
 Principal Investigator
 (937) 433-2886
Business Contact
 V. Nagarajan
Title: Business Official
Phone: (937) 433-2886
Email: vnagarajan@Rnet-Tech.com
Research Institution
NASA is interested in the development of advanced instruments and instrument components for planetary science missions. Specifically, an area of importance in relation to in situ sensors and sensor systems is instrument deployment on a variety of space platforms, which include orbiters, flyby spacecraft, landers, rovers, balloon, other aerial vehicles, subsurface penetrators, and impactors. These instrumentation and space platforms are to be used in the exploration of inner and outer planets and their moons, comets, asteroids, etc. As a direct consequence, the instrumentation systems are subjected to space and planetary environmental extremes including temperature, pressure, radiation, and impact stresses during operation. In particular, NASA is soliciting instrument development that provides advancements in several specific areas. One of these areas is "Radiation mitigation strategies, radiation tolerant detectors, and readout electronics components for candidate instruments for the Europa-Jupiter System Mission (EJSM)". We intend to answer NASA's need for a suitable radiation resistant ROIC technology for future planetary science missions through the integration of advanced radiation hardening technologies incorporating radiation hardening by design (RHBD) technologies, as well as the use of an advanced multi-gate integrated circuit technologies. Additional focus will be on the reduction of cost, size, weight, and power.

* Information listed above is at the time of submission. *

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