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Low Cost Advanced Composite Structures

Award Information
Agency: Department of Defense
Branch: Air Force
Contract: N/A
Agency Tracking Number: 28268
Amount: $750,000.00
Phase: Phase II
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1996
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
184 Cedar Hill St
Marlborough, MA 01752
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Mr. Patrick E. Mack
 (508) 481-5058
Business Contact
Phone: () -
Research Institution

Aspen Systems, Inc. proposes the program "Novel Thermosets For Room Temperature Cured Aerospace Composites." Aerospace composites must maintain integrity at 350F (177C). With current resin systems, this is only achievable through elevated cure cycling, translating to added costs throughout the manufacturing process and a reduced composite damage tolerance. To meet the challenge of high temperature performance with reduced processing costs and increased damage tolerance, Aspen proposes the development of a new class of epoxy resins amenable to room temperature curing. The proposed system initiates a close functional group packing density, allowing complete conversion at substantially below the polymers final glass transition temperature. The result is a high temperature, high strength polymer cured at room temperature with enhanced damage tolerance. Designed from the molecular level, this system represents the leading edge in epoxy functional monomer design research, and the maximum opportunity for significant cost reductions in aerospace quality composite fabrication. The Aspen Research and Development Team is comprised of world leading experts in computational molecular modelling, polymer, & material science, advanced composites, and aerospace engineering. Our external consultants included the Lockheed Fort Worth Company, Dr. Morton H. Litt of Case Western Reserve University and the Edison Polymer Innovation Corporation.

* Information listed above is at the time of submission. *

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