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Novel Liquid Crystal Thermosets for Barrier Coating Binder Matrices

Award Information
Agency: Department of Defense
Branch: Army
Contract: N/A
Agency Tracking Number: 36787
Amount: $99,970.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: N/A
Solicitation Number: N/A
Solicitation Year: N/A
Award Year: 1997
Award Start Date (Proposal Award Date): N/A
Award End Date (Contract End Date): N/A
Small Business Information
184 Cedar Hill St
Marlborough, MA 01752
United States
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Patrick E. Mack
 (508) 481-5058
Business Contact
Phone: () -
Research Institution

To meet the challenge of impermeable barrier coatings for honeycomb composite structures, Aspen Systems, Inc. proposes the program "Novel Liquid Crystal Thermosets for Barrier Coating Binder Matrices". Designed from the molecular level, these new materials are based on room temperature, solventless processable, orderable, low molecular weight, liquid crystalline (mesophasic) structures with flexible, difunctional epoxy end groups. The resulting ultracoating binder matrix is self reinforced, toughened at the molecular level, and highly inpermeable due to its high molecular packing density and low free volume area. This system represents the leading edge in barrier coating design, and a maximum opportunity for significant cost reductions in aerospace quality composites through improved maintainability and supportability. The Aspen Research and Development Team is comprised of world leading experts in polymer & material science, advanced composites, computational modeling, and aerospace engineering. Our external consultants include Dr. Benjamin Freeman of North Carolina State University and The Center for Applied Engineering, Inc. Honeycomb composite materials have found widespread application in the private commerical sector. The resulting benefits of improved performance through liquid crystal thermoset enhanced barrier coatings includes broader composite design penetration and greater design flexibility.

* Information listed above is at the time of submission. *

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