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Modular Transit Case Cooler

Award Information
Agency: Department of Defense
Branch: Army
Contract: W15P7T-09-C-S004
Agency Tracking Number: A082-083-0574
Amount: $119,988.00
Phase: Phase I
Program: SBIR
Solicitation Topic Code: A08-083
Solicitation Number: 2008.2
Solicitation Year: 2008
Award Year: 2008
Award Start Date (Proposal Award Date): 2008-11-17
Award End Date (Contract End Date): 2010-02-14
Small Business Information
184 Cedar Hill Street
Marlborough, MA 01752
United States
DUNS: 121001945
HUBZone Owned: No
Woman Owned: No
Socially and Economically Disadvantaged: No
Principal Investigator
 Glenn Deming
 Vice President
 (508) 281-5322
Business Contact
 Kang Lee
Title: President
Phone: (508) 481-5058
Research Institution

Aspen Systems proposes to develop a modular cooling system for mobile electronics applications. This system will be highly adaptable and have the capability to maintain lower than ambient temperatures in mobile and stationary electronics enclosures that are deployed to hot desert environments. While maintaining these low operating temperatures, the electronics systems will be completely sealed against dirt rain and dust so that MIL STD-810F environmental requirements can be met. Features include a high degree of modularity, enabling the rapid fabrication and fielding of cooling systems that are tailored to system requirements without non recurring engineering costs. The major benefit to the warfighter is the ability to utilize very high performance Commercial Off The Shelf (COTS) electronics with out jeopardizing system life due to thermal overload of sensitive electronics. The system will be designed for minimum power consumption, minimum weight, maximum efficiency, and high modularity. With small size and high cooling power, multiple units can be used in the same enclosure to match the cooling requirements against the thermal load in the system. It is anticipated that the system will be fully tested at the conclusion of Phase I, and ready for production at the conclusion of Phase II.

* Information listed above is at the time of submission. *

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