Ultra-High Heat Flux Condenser for Electronics Cooling

Award Information
Agency: Department of Defense
Branch: Navy
Contract: N00014-10-C-0090
Agency Tracking Number: O081-EP7-4071
Amount: $683,593.00
Phase: Phase II
Program: SBIR
Awards Year: 2009
Solicitation Year: 2008
Solicitation Topic Code: OSD08-EP7
Solicitation Number: 2008.1
Small Business Information
184 Cedar Hill Street, Marlborough, MA, 01752
DUNS: 121001945
HUBZone Owned: N
Woman Owned: N
Socially and Economically Disadvantaged: Y
Principal Investigator
 Steve Casey
 Program Manager
 (508) 281-5322
Business Contact
 Kang Lee
Title: President
Phone: (508) 481-5058
Email: klee@aspensystems.com
Research Institution
Aspen Systems’ proposes a high heat flux condenser that contains to two key elements: 1) novel enhanced microchannel surfaces and 2) a viable condenser system configuration that provides an efficient, compact, and scalable arrangement for the system of microchannels. In Phase I, Aspen designed and demonstrated the feasibility of achieving over 60,000 W/m2-K overall heat transfer coefficient using novel enhanced microchannel surfaces to efficiently transfer heat from condensing R-134a to liquid water. Each of the three enhanced surfaces dramatically improves heat transfer with reasonable pressure drop while offering its own unique benefits. Furthermore, these novel microchannels were proven feasible within the framework of a working design concept for the condenser system. The proposed Phase II program is a technology and product development effort to demonstrate a very compact, lightweight, and efficient 5kW condenser for electronics cooling applications. To enable this result, ultra-high heat flux from refrigerant to water will be achieved by advancing the enhanced microchannel technologies that were demonstrated in Phase I for both two-phase condensing refrigerant and liquid water. This knowledge will then be used to design, build, and demonstrate an ultra-high heat flux condenser in a cooling system applicable to electrics cooling.

* Information listed above is at the time of submission. *

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