Large-area and low-cost hybrid SIC wafers

Award Information
Agency:
Department of Defense
Branch
Missile Defense Agency
Amount:
$65,000.00
Award Year:
2002
Program:
SBIR
Phase:
Phase II
Contract:
DNA01-99-0097
Award Id:
58674
Agency Tracking Number:
99-0063
Solicitation Year:
n/a
Solicitation Topic Code:
n/a
Solicitation Number:
n/a
Small Business Information
2500 Central Ave., Boulder, CO, 80301
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
n/a
Principal Investigator:
JohnTorvik
Senior Scientist
(303) 413-1440
jtorvik@astraluxinc.com
Business Contact:
RandolphTreece
VP Business Development
(303) 413-1440
rtreece@astraluxinc.com
Research Institute:
n/a
Abstract
"Researchers at Astralux, Inc. in collaboration with Sterling Semiconductor, EMCORE Corp. and the University of Colorado at Boulder propose to develop hybrid SiC wafers using a novel technique. Specifically, our goal is to commercialize epi-ready 3-inchand 4-inch 4H and 6H SiC wafers for the emerging wide bandgap microwave device market. Our hybrid SiC wafers are complementary to the existing bulk SiC wafers, and our value added is to increase the production volume and significantly reduce the cost oflow-defect larger-area substrates. With market acceptance, we will add products such as wafers of different conductivity types for near-dc high voltage/power devices (off-axes) and possibly even laser diodes (on-axes). During Phase I, researchers atAstralux demonstrated a three-step process to make hybrid SiC wafers. All Phase I milestones were reached, the goals accomplished and we are now ready for prototype development in Phase II. An important feature of this program is to work closely with aSiC manufacturer to gain access to the best available SiC wafers and an AlGaN HEMT manufacturer who will test our substrates by growing/fabricating/testing RF devices and comparing the performance with devices made on conventional substrates."

* information listed above is at the time of submission.

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