Thermavant Technologies, L.L.C.

Company Information
Address 1000 Pannell St Ste A
Columbia, MO, 65201-4786


DUNS: 808369792

# of Employees: 6

Ownership Information

HUBZone Owned: N

Socially and Economically Disadvantaged: N

Woman Owned: N

Award Charts

Award Listing

  1. Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)

    Amount: $79,996.00

    In this Phase I effort, ThermAvant will design, fabricate and empirically demonstrate high-thermal conductivity heat spreaders for high power GaN Power Amplifiers (PAs) on advanced Navy platforms. The ...

    SBIRPhase I2016Department of Defense Navy
  2. Solid-State Power Amplifier Thermal Management

    Amount: $149,976.00

    ABSTRACT: ThermAvant proposes to design, model and empirically demonstrate Oscillating Heat Pipes for the acquisition, transport and rejection of waste heat generated from next-generation PA devices w ...

    SBIRPhase I2016Department of Defense Air Force
  3. High Power Density Structural Heat Spreader

    Amount: $750,000.00

    ThermAvant proposes to build upon Phase I efforts wherein a novel oscillating heat pipe channels were emplaced inside envelope materials, charged with a range novel working fluids, and then tested at ...

    SBIRPhase II2016Department of Defense Air Force
  4. High Power Density Structural Heat Spreader

    Amount: $150,000.00

    ABSTRACT:The proposed research effort will develop passive Oscillating Heat Pipe (OHP) structural heat spreaders to attach to small, ultra-high heat flux devices (e.g., GaN power amplifiers) and dissi ...

    SBIRPhase I2015Department of Defense Air Force
  5. Cylindrical Geometry Energy Storage Cooling Architectures

    Amount: $995,897.00

    Future military platforms will require more extensive use of electronic power systems to achieve required performance levels. Energy storage is becoming a key enabler for power systems operating with ...

    SBIRPhase II2015Department of Defense Office of the Secretary of Defense
  6. Thermal Management Improvements for Transmit/Receive Modules

    Amount: $79,942.00

    An oscillating heat pipe (OHP) embedded substrate made from low coefficient of thermal expansion (CTE) material(s) will be designed, simulated, optimized, fabricated, and empirically tested to demonst ...

    SBIRPhase I2013Navy Department of Defense
  7. Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

    Amount: $742,600.00

    ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to tran ...

    SBIRPhase II2013Air Force Department of Defense
  8. Cylindrical Geometry Energy Storage Cooling Architectures

    Amount: $150,000.00

    ThermAvant Technologies, LLC and University of Texas at Arlington propose to design, model, fabricate and empirically test conformal fitting cylindrical energy storage heat cooling packages. ThermAvan ...

    SBIRPhase I2013Department of Defense Navy
  9. SBIR Phase I: High Efficiency Multi-fluid Jet Refrigeration

    Amount: $150,000.00

    This Small Business Innovation Research Phase I project will demonstrate a highly efficient supersonic ejector vapor compression technology that converts low-to-medium grade thermal energy (200-400F) ...

    SBIRPhase I2012National Science Foundation
  10. Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

    Amount: $149,947.00

    ABSTRACT: Miniature flat plate oscillating heat pipe (FP-OHP) heat spreaders using ThermAvant's patent-pending ThermalCircuit architecture and low CTE materials will be demonstrated in order to ...

    SBIRPhase I2012Department of Defense Air Force

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