Thermavant Technologies, L.L.C.

Company Information
Address 1000 Pannell St Ste A
Columbia, MO, 65201-4786

http://www.thermavant.com

Information

DUNS: 808369792

# of Employees: 6


Ownership Information

HUBZone Owned: N

Socially and Economically Disadvantaged: N

Woman Owned: N



Award Charts




Award Listing

  1. Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)

    Amount: $496,921.00

    Electrical systems are being designed with ever increasing power densities, particularly future radar and electronic warfare systems built with Gallium Nitride on Silicon Carbide Monolithic Integrated ...

    SBIRPhase II2017Department of Defense Navy
  2. Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

    Amount: $750,000.00

    This proposed Phase II sequential effort will build upon the Phase I and original Phase II programs by: 1) Supporting AFRL's ongoing flight experiment of Oscillating Heat Pipe (OHP) chip carriers to e ...

    SBIRPhase II2017Department of Defense Air Force
  3. Solid-State Power Amplifier Thermal Management

    Amount: $749,955.00

    Based on successful Phase I feasibility prototype results, this Phase II SBIR project shall develop Long-Distance Oscillating Heat Pipe (LD-OHP) heat transporters for high power, high temperature and ...

    SBIRPhase II2017Department of Defense Air Force
  4. Advanced Heat Spreader Technology for Gallium Nitride (GaN) Monolithic Microwave Integrated Circuits (MMICs)

    Amount: $79,996.00

    In this Phase I effort, ThermAvant will design, fabricate and empirically demonstrate high-thermal conductivity heat spreaders for high power GaN Power Amplifiers (PAs) on advanced Navy platforms. The ...

    SBIRPhase I2016Department of Defense Navy
  5. Solid-State Power Amplifier Thermal Management

    Amount: $149,976.00

    ABSTRACT: ThermAvant proposes to design, model and empirically demonstrate Oscillating Heat Pipes for the acquisition, transport and rejection of waste heat generated from next-generation PA devices w ...

    SBIRPhase I2016Department of Defense Air Force
  6. High Power Density Structural Heat Spreader

    Amount: $750,000.00

    ThermAvant proposes to build upon Phase I efforts wherein a novel oscillating heat pipe channels were emplaced inside envelope materials, charged with a range novel working fluids, and then tested at ...

    SBIRPhase II2016Department of Defense Air Force
  7. High Power Density Structural Heat Spreader

    Amount: $150,000.00

    ABSTRACT:The proposed research effort will develop passive Oscillating Heat Pipe (OHP) structural heat spreaders to attach to small, ultra-high heat flux devices (e.g., GaN power amplifiers) and dissi ...

    SBIRPhase I2015Department of Defense Air Force
  8. Cylindrical Geometry Energy Storage Cooling Architectures

    Amount: $995,897.00

    Future military platforms will require more extensive use of electronic power systems to achieve required performance levels. Energy storage is becoming a key enabler for power systems operating with ...

    SBIRPhase II2015Department of Defense Office of the Secretary of Defense
  9. Thermal Management Improvements for Transmit/Receive Modules

    Amount: $79,942.00

    An oscillating heat pipe (OHP) embedded substrate made from low coefficient of thermal expansion (CTE) material(s) will be designed, simulated, optimized, fabricated, and empirically tested to demonst ...

    SBIRPhase I2013Navy Department of Defense
  10. Next-Generation Micro-chip Carrier for Cooling of Satellite Payload Electronics

    Amount: $742,600.00

    ABSTRACT: A chip carrier for high power density electronics made from low CTE materials and embedded with an oscillating heat pipe will be applied to a real world satellite electronics device to tran ...

    SBIRPhase II2013Air Force Department of Defense

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