Advanced Low Thermal Resistance, Large Heat Capacity Coolers For Semiconductor Devices

Award Information
Agency:
Department of Defense
Branch
Defense Advanced Research Projects Agency
Amount:
$1,749,666.00
Award Year:
2010
Program:
SBIR
Phase:
Phase II
Contract:
W31P4Q-10-C-0198
Award Id:
78236
Agency Tracking Number:
O053-D03-4130
Solicitation Year:
n/a
Solicitation Topic Code:
DARPA 05-D03
Solicitation Number:
n/a
Small Business Information
15 WARD STREET, SOMERVILLE, MA, 02143
Hubzone Owned:
N
Minority Owned:
N
Woman Owned:
N
Duns:
106771140
Principal Investigator:
HENRY EPPICH
PRINCIPAL INVESTIGATOR
(617) 547-1122
HEPPICH@SRL.COM
Business Contact:
JONAH JACOB
PRESIDENT
(617) 547-1122
JJACOB@SRL.COM
Research Institution:
n/a
Abstract
There is a critical need for revolutionary approaches for thermal management of 21st century semiconductor devices and hardware, such as advanced high performance computers, high-power laser diodes and solar cells for the conversion of sun light to renewable energy. The one limiting factor for all of the above extremely important and compelling technologies is waste heat management that can remove several kilowatts of waste heat while simultaneously providing a low thermal resistance to that keeps the semiconductor junction temperature as low as possible. The reason for maintaining a low junction temperature is that all semiconductors perform better at lower temperature. SRL has recently demonstrated the dramatic potential of our advanced thermal management technology by extracting more than a kilowatt of optical power from a centimeter-wide laser-diode (LD) bar, which represents a 10X increase over the state-of-the-art. This successful demonstration was completed by attaching the LD chip to a pre-prototype, low thermal-resistance, high thermal-capacity, enhanced-performance impingement-cooler (EPIC). In this effort, SRL will demonstrate that the EPIC cooler can be built with a thickness of 3mm and preserve its low thermal resistance and high thermal capacity

* information listed above is at the time of submission.

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