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NOTE: The Solicitations and topics listed on this site are copies from the various SBIR agency solicitations and are not necessarily the latest and most up-to-date. For this reason, you should visit the respective agency SBIR sites to read the official version of the solicitations and download the appropriate forms and rules.

If no search results for your keyword(s) were found, you are encouraged to review Agency omnibus solicitations for additional funding opportunities. Omnibus solicitations are structured to be broad, extensive Programmatic issuances with research areas related to the petitioning Agency and are not limited to predetermined Topics/Subtopics. If upon reviewing you have additional questions, you may consider reaching out to the respective Agency for clarification regarding acceptable proposals (https://www.sbir.gov/agency-contacts).

  1. DMEA18B-001: Automated In-situ Large-area De-processing of ICs with High Throughput

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Materials, Sensors, Eletronics  OBJECTIVE: Develop an automated & high throughput technology, which performs similar to the gas assisted etch (GAE) focused ion beam (FIB)-scanning electron microscope (SEM) for delayering an entire IC to perform 3D chip reconstruction for use in reverse engineering and physical failure analysis applications.  DESCRIPTIO ...

    STTR Defense Microelectronics ActivityDepartment of Defense
  2. DMEA182-001: Handheld Liquid Particle Counter

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Design new and innovative handheld liquid particle counter for semiconductor manufacturing.  DESCRIPTION: The trend of processing technology is for more advanced complex devices integrated in smaller size. Particles could become significantly more as killer defects. Therefore, detecting and measuring particles for liqu ...

    SBIR Defense Microelectronics ActivityDepartment of Defense
  3. DMEA182-002: Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property (IP) Protection

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Evaluate and demonstrate the feasibility of converting a generic and typical single die ASIC design into a multiple die stack and characterize the AC and DC parametric parameter shifts  DESCRIPTION: Normal and typical Application Specific Integrated Circuit (ASIC) manufacturing techniques require that the designer of a ...

    SBIR Defense Microelectronics ActivityDepartment of Defense
  4. DMEA182-003: BlockChain Supply Chain Enhancement for Trusted & Assured FPGA’s and ASICs

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Develop an affordable and highly secure Supply Chain Risk Management (SCRM) system enhanced by blockchain technology.  DESCRIPTION: Trusted & Assured microelectronics supply chains are globally distributed and offer many opportunities for supply chain interdiction and compromise by adversaries. An opportunity exists ...

    SBIR Defense Microelectronics ActivityDepartment of Defense

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