Closed

Reset

NOTE: The Solicitations and topics listed on this site are copies from the various SBIR agency solicitations and are not necessarily the latest and most up-to-date. For this reason, you should visit the respective agency SBIR sites to read the official version of the solicitations and download the appropriate forms and rules.

  1. DMEA182-001: Handheld Liquid Particle Counter

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Design new and innovative handheld liquid particle counter for semiconductor manufacturing.  DESCRIPTION: The trend of processing technology is for more advanced complex devices integrated in smaller size. Particles could become significantly more as killer defects. Therefore, detecting and measuring particles for liqu ...

    SBIR Defense Microelectronics ActivityDepartment of Defense
  2. DMEA182-002: Front End of Line and Back End of Line Layer Fabrication Partitioning for the Purpose of Design Intellectual Property (IP) Protection

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Evaluate and demonstrate the feasibility of converting a generic and typical single die ASIC design into a multiple die stack and characterize the AC and DC parametric parameter shifts  DESCRIPTION: Normal and typical Application Specific Integrated Circuit (ASIC) manufacturing techniques require that the designer of a ...

    SBIR Defense Microelectronics ActivityDepartment of Defense
  3. DMEA182-003: BlockChain Supply Chain Enhancement for Trusted & Assured FPGA’s and ASICs

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Sensors, Electronics  OBJECTIVE: Develop an affordable and highly secure Supply Chain Risk Management (SCRM) system enhanced by blockchain technology.  DESCRIPTION: Trusted & Assured microelectronics supply chains are globally distributed and offer many opportunities for supply chain interdiction and compromise by adversaries. An opportunity exists ...

    SBIR Defense Microelectronics ActivityDepartment of Defense
  4. DMEA18B-001: Automated In-situ Large-area De-processing of ICs with High Throughput

    Release Date: 04-20-2018Open Date: 05-22-2018Due Date: 06-20-2018Close Date: 06-20-2018

    TECHNOLOGY AREA(S): Materials, Sensors, Eletronics  OBJECTIVE: Develop an automated & high throughput technology, which performs similar to the gas assisted etch (GAE) focused ion beam (FIB)-scanning electron microscope (SEM) for delayering an entire IC to perform 3D chip reconstruction for use in reverse engineering and physical failure analysis applications.  DESCRIPTIO ...

    STTR Defense Microelectronics ActivityDepartment of Defense
  5. DMEA172-001: Computerized Automatic Delayering and Polishing System

    Release Date: 04-21-2017Open Date: 05-23-2017Due Date: 06-21-2017Close Date: 06-21-2017

    TECHNOLOGY AREA(S): Sensors  OBJECTIVE: Develop a tool for automated, procedural delayering and polishing of semiconductor microelectronic devices  DESCRIPTION: Sample preparation, in the world of semiconductor microelectronic devices, has proved to be one of the most critical aspects of Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE). In addition ...

    SBIR Department of DefenseDefense Microelectronics Activity
  6. DMEA172-002: Through-Lens Fiducial Marking System

    Release Date: 04-21-2017Open Date: 05-23-2017Due Date: 06-21-2017Close Date: 06-21-2017

    TECHNOLOGY AREA(S): Sensors  OBJECTIVE: Develop a tool for through-lens fiducial marking on the backside of semiconductor devices.  DESCRIPTION: Infrared (IR) Microscopes are used in the Failure Analysis (FA) and Fault Isolation (FI) of semiconductor devices because of the fact that silicon is transparent to near-IR (NIR) light. Some of these microscopes use Charge-Coupled ...

    SBIR Department of DefenseDefense Microelectronics Activity
  7. DMEA16B-001: Thickness Measurement Technology for Thin Films on Sapphire Substrate

    Release Date: 04-22-2016Open Date: 05-23-2016Due Date: 06-22-2016Close Date: 06-22-2016

    TECHNOLOGY AREA(S): Electronics, SensorsThe technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), which controls the export and import of defense-related material and services. Offerors must disclose any proposed use of foreign nationals, their country of origin, and what tasks each would accomplish in the statement of work in accordance with section ...

    STTR Department of DefenseDefense Microelectronics Activity
  8. DMEA162-001: High-brilliance 9keV X-ray Source

    Release Date: 04-22-2016Open Date: 05-23-2016Due Date: 06-22-2016Close Date: 06-22-2016

    TECHNOLOGY AREA(S): Electronics, SensorsOBJECTIVE: Develop a high-flux 9keV x-ray source with a spot size larger than 10umDESCRIPTION: Rapid Integrated Circuit (IC) inspection has become a high priority. X-ray inspection of large volumes of an IC is limited to the high intensity beams at a synchrotron. However, those facilities are not easily accessible for routine inspection of parts. Table-top x ...

    SBIR Department of DefenseDefense Microelectronics Activity
  9. DMEA15B-001: Optimized Scintillator for High Resolution X-ray Imaging at 9keV

    Release Date: 04-24-2015Open Date: 05-26-2015Due Date: 06-24-2015Close Date: 06-24-2015

    Rapid Integrated Circuit (IC) inspection using x-ray microscopy requires novel x-ray scintillating materials with high efficiency and high spatial resolution. Current scintillator materials, such as Cesium Iodide (CsI), suffer from a trade-off between efficiency and spatial resolution. Novel materials with higher stopping power and light yields are necessary to address the stringent requirements o ...

    STTR Department of DefenseDefense Microelectronics Activity
  10. DMEA13B-001: Electrochemical Micro-Capacitors Utilizing Carbon Nanostructures

    Release Date: 07-26-2013Open Date: 08-26-2013Due Date: 09-25-2013Close Date: 09-25-2013

    TECHNOLOGY AREAS: Materials/Processes, Electronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), which controls the export and import of defense-related material and services. Offerors must disclose any proposed use of foreign nationals, their country of origin, and what tasks each would accomplish in the statement of work in accordan ...

    STTR Department of DefenseDefense Microelectronics Activity

Agency Micro-sites

SBA logo
Department of Agriculture logo
Department of Commerce logo
Department of Defense logo
Department of Education logo
Department of Energy logo
Department of Health and Human Services logo
Department of Homeland Security logo
Department of Transportation logo
Environmental Protection Agency logo
National Aeronautics and Space Administration logo
National Science Foundation logo
US Flag An Official Website of the United States Government