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OBJECTIVE: Develop an affordable x-ray microscope system for use in performing integrated circuit (IC) reverse engineering. DESCRIPTION: X-ray microscopy using a synchrotron as the x-ray source has been demonstrated to be an extremely valuable tool in the performance of high throughput integrated circuit evaluation and reverse engineering efforts. However, synchrotron x-ray sources are prohi ...

OBJECTIVE: Design and prototype a capability to use fiber optic cable to simultaneously distribute power (i.e power over fiber) while providing full duplex information flow. The capability will allow miniature microwave system components to be distributed over a relatively long distance (i.e. 30 meters or more) via fiber optics. For example, a processing node (within a microwave system) provid ...

OBJECTIVE: Develop a system for the accurate identification and analysis of semiconductor materials with integrated, high-resolution imaging capability for the three-dimensional digital reconstruction of integrated circuits (ICs). DESCRIPTION: As semiconductor geometries continue to diminish, so too does the applicability of traditional sample preparation tools. As the thickness of metal l ...

TECHNOLOGY AREAS: Materials/Processes, Electronics The technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), which controls the export and import of defense-related material and services. Offerors must disclose any proposed use of foreign nationals, their country of origin, and what tasks each would accomplish in the statement of work in accordan ...

Counterfeit and subversively modified electronic components represent a substantial threat to Department of Defense (DoD) systems. Testimony to the Senate Armed Services Committee (SASC) concluded that “the scope and impact of counterfeits is not known … counterfeit electronic parts can compromise performance and reliability, risk national security, and endanger the safety of military personne ...

The DARPA TRUST program established the potential usefulness of using an X-Ray microscope to analyze ICs at a synchrotron. We would like to further that development using a lab based X-Ray source. When utilizing a lab X-ray source, acquisition times for X-ray images increase significantly compared to using a synchrotron X-ray source. This is due to the decreased number of X-ray photons (i.e., X-ra ...

Rapid Integrated Circuit (IC) inspection using x-ray microscopy requires novel x-ray scintillating materials with high efficiency and high spatial resolution. Current scintillator materials, such as Cesium Iodide (CsI), suffer from a trade-off between efficiency and spatial resolution. Novel materials with higher stopping power and light yields are necessary to address the stringent requirements o ...

TECHNOLOGY AREA(S): Electronics, SensorsThe technology within this topic is restricted under the International Traffic in Arms Regulation (ITAR), which controls the export and import of defense-related material and services. Offerors must disclose any proposed use of foreign nationals, their country of origin, and what tasks each would accomplish in the statement of work in accordance with section ...

TECHNOLOGY AREA(S): Electronics, SensorsOBJECTIVE: Develop a high-flux 9keV x-ray source with a spot size larger than 10umDESCRIPTION: Rapid Integrated Circuit (IC) inspection has become a high priority. X-ray inspection of large volumes of an IC is limited to the high intensity beams at a synchrotron. However, those facilities are not easily accessible for routine inspection of parts. Table-top x ...

TECHNOLOGY AREA(S): Sensors OBJECTIVE: Develop a tool for automated, procedural delayering and polishing of semiconductor microelectronic devices DESCRIPTION: Sample preparation, in the world of semiconductor microelectronic devices, has proved to be one of the most critical aspects of Failure Analysis (FA), Fault Isolation (FI), and Reverse Engineering (RE). In addition to its criticality, it g ...